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     PCB Design Checklist

             This checklist is for the preparation of a PCB layout prior to the layout phase, during the layout and in the final layout review.
             There are many details that go into making a first-run board success.

             The following elements of the PCB layout are covered:
             1. Pad definition
             2. Placement consideration
             3. Routing guidelines and priorities
             4. Testing considerations
             5. Marking definitions and requirements
             6. Fabrication

   
  How to use this checklist:

             1. Copy the file to your archive/templates
             2. Edit to include/exclude the elements that are important for you
             3. Once a failure occurs, update the checklist
             4. Share it with your colleagues

             Help us to update this list. Send us your remarks so we can share the knowledge

     
 Pad definition

              Finished hole size is at least 10 mils larger than lead if no other data available
              Pads of through hole components are at least 12 mils larger than finished hole sizes
              Solder-mask does or does not cover via
              Solder paste openings are in proper size
              Tooling and mounting holes have internal plane clearance
              Thermal relief for internal power layers is defined
              Blind and buried via defined
              Ground test points sized for scope ground clip and easy access


     
 Placement consideration

             
Place through hole components on 50 mil grid
              Components and test pads are placed at least 200 mils from edge of board
              At least 15 mils spacing between components body
              Visible reference designators for automated assembly
              Component and trace void areas are observed
              Sufficient clearance for socket mounted ICs
              Clearances for IC extraction tools, emulator adapter and rework tools are considered
              There are standoffs for power resistors or other hot components
              Check the orientation of all connectors
              Bypass capacitors located close to IC power pins
              Place parts (especially ceramics) at least 50 mils (1.25 mm) from PCB edge
              Verify that all series terminators are located near the transmitter
              Verify that all parallel terminators are located near the receiver
              Place I/O drivers near the edge of the board where they leave
              High frequency crystal cases should be grounded
              No via under metal-film resistors and similar poorly insulated parts
              Try to populate the board evenly

      
Routing guidelines

              LVDS/differential/controlled impedance signals specified
              Digital and analog signal commons joined at only one point
              All nets have meaningful names with modifiers for signal polarity
              Ground planes where possible
              Traces are routed at least 20 mils (40 mils preferred) from edge of PCB
              The 20-H rule is implemented to minimize EMI
              Trace and space rules defined (5/5 is standard for signals)
              Trace width is sufficient for the current in the specific layer (Use IPC-2221 charts)
              Sufficient clearance for high voltage traces (Use IPC-2221 charts)
              Check for traces under noisy or sensitive components
              Check for hangers (dead end traces)
              Check that Power is not shorted to GND
              Provide multiple via (or one large via) for high current and/or low impedance traces
              Voltage regulator trace width are large enough for the output current desired

      
Testing considerations

              Test pad or test via on every net
              Test pads are evenly distributed (if possible) on one side of the PCB
              Test point on all unused outputs for debug use
              No logic pins connected directly to power or ground if in-circuit test is planned
              In circuit programming connectors are placed near the programmed device

     
 
Marking

              Silkscreen text fonts are larger than 36 mils (0.9 mm) wherever possible
              No silkscreen text over holes or pads
              All legend text reads in one or two directions
              If back annotate is required, prefer components labeled left-right, top-bottom
              All polarized components are marked for assembly orientation
              Company logo is in silkscreen layer
              Layers window is ‘transparent’ (free of solder mask or planes)
              PCB/Assembly part number on PCB (copper or silkscreen, top or bottom)
              PCB revision on silkscreen layer
              Assembly revision blank on silkscreen layer
              Serial number blank on silkscreen layer (top or bottom)
              All silkscreen text is readable when the board is populated
              All ICs have pin one clearly marked and visible when chip is assembled
              High pin count components have corner pins numbered for ease of location
              Silkscreen tick marks for every 10th or 20th pin on high pin count ICs and connectors

      
Fabrication

              Fabrication layer contains as a minimum:
                       • PCB identification (part number and revision)
                       • Date
                       • Drill table shows all symbols and sizes
                       • PCB specification
                        PCB thickness
                       • Material
                       • Copper weight on inner and outer layer
                       • Finish
                       • Editor identification
              Mounting holes matched 1:1 with mating parts
              Mounting holes electrically isolated or not
              Proper mounting hole clearance for hardware
              Tooling holes for automated assembly exist
              Tools on drill plot and NC drill file cross checked
              Solder mask over bare copper (SMOBC) noted if needed
              PCB thickness, material, copper weight and finish noted
              Solder mask and silkscreen type noted
              Photoplot/Gerber files checked using file viewer
              Panelized PCB fits assembly test and manufacturing equipment
              Ensure global board fiducials are present - minimum 3 per board in opposing corners
              In a panelized layout, ensure panel fiducials are present - 3 per panel in opposing corners
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